Summary
The Summary tab provides a comprehensive overview of the assembly at a glance. Use it to verify project completeness before production handover.
Component overview
The top row shows key counts:
- SMD – total surface-mount components (top/bottom breakdown)
- THT – total through-hole components (top/bottom breakdown)
- DNP – components marked Do Not Populate
- BOM Lines – total BOM lines by type (SMD, THT, MNT)
PCB information
A card showing the board parameters configured in the PCB tab:
- Board dimensions and layer count
- Base material, laminate, surface finish, copper thicknesses, and board thickness
- Soldermask / legend sides and colors, and IPC 471 via cover
- Board area
- Count of unmatched components (with link to resolve)
Placement categories (SMD)
SMD components grouped by placement speed category:
- Chip (fast) – passive chip components (0201, 0402, 0603, etc.)
- Standard – standard IC packages (SOIC, SOT, etc.)
- QFP/QFN – fine-pitch quad packages
- Other – all remaining SMD components
Each category shows the count and percentage.
Wave soldering
A heuristic check indicating whether the board is suitable for wave soldering:
- Suitable – all THT components are on one side
- Conditionally suitable – some restrictions apply
- Not suitable – THT on both sides or other blockers
The check considers component placement and board geometry.
Hand solder estimate
Estimated solder points per board based on THT pin counts, with average pins per component shown.
Assembly warnings
Flags for production considerations:
- Unmatched library packages
- Mixed technology (SMD + THT) requiring multiple process steps
- BGA components (X-ray inspection required)
- Fine-pitch components
- Double-sided SMD placement
Copy Summary
Click Copy Summary to copy a plain-text summary to the clipboard for quotation documents or internal communication.